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Optoelectronics & displays packaging has been a significant activity at TWI for approximately 25 years. Work in this area has expanded to cover:
- Low heat input/hermetic sealing
- Laser/diode alignment/attachment systems
- Substrate attachment systems
- Interconnection systems
- Development of alignment jigs
- Development of glass attachment systems
- Measurement of fibre attachment adhesive shrinkage during curing
- Assessment of the impact of assembly materials/processes on fibre alignment/stability
- Flat panel display ruggedisation
- Printable ITO
- ITO replacement
- OLED packaging
- Troubleshooting opto-packaging production problems
To address work in these areas, TWI brings together its skills and experience in optoelectronics packaging, materials (metals, polymers, ceramics and glass), adhesive/encapsulant systems, surface conditioning, finite element modelling, inspection, NDT, QA/QC and manufacturing systems.
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