TWI has been actively involved in electronic packaging for over 40 years. Work has covered all aspects of chip attachment (adhesives, soldering, glass, mechanical etc), interconnection (flip chip, TAB, wire bonding, adhesives etc), encapsulation (glob top, potting, plastic moulding), hermetic sealing (soldering, brazing, welding, glass fusion) and substrate/board assembly.
Additional key elements of TWI's work include: product design/modelling, quality assessment/control, testing (e.g. mechanical, thermal and environmental), manufacturability and troubleshooting.
Typical projects include:
- Development of Al and Cu wire ball bonding
- Development of flip chip stud bumping technology
- Assessment of flip chip bonding techniques
- Development and verification of high thermal conductivity die attach techniques
- Development of a large area die rework station
- Assessment of conductive adhesives for SMT and space environments
- Packaging technologies for the display/sensor industry
- Performance of resin encapsulants/potting materials
- Low stress hermetic sealing technology
- Miniaturised electronics/sensors for medical implants
- EMI shielding for discrete devices
- Wettability of Pb-free solder
- Fine pitch soldering technology
- Integrated passive systems
Facilities for conducting this work are based at the Microtechnology Centre in Cambridge.
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