Optoelectronics
Optoelectronics packaging has been a significant activity at TWI for approximately 20 years. TWI was originally involved in the development of laser ferrule welding technology for some of the earliest opto packages. Since then work in this area has expanded to cover:
- Low heat input/hermetic sealing
- Laser/diode alignment/attachment systems
- Substrate attachment systems
- Interconnection systems
- Measurement of fibre attachment adhesive shrinkage during curing
- Development of glass attachment systems
- Development of alignment jigs
- Assessment of the impact of assembly materials/processes on fibre alignment/stability
- Troubleshooting opto-packaging production problems.
To address work in these areas, TWI brings together its skills and experience in optoelectronics packaging, materials (metals, polymers, ceramics and glass), adhesive/encapsulant systems, surface conditioning, finite element modelling, inspection, NDT, QA/QC and manufacturing systems. A large number of projects have been performed by TWI for industrial members both singly and collectively. Find out more about the processes by looking at the Knowledge Summaries and Best Practice Guides. The outcome of a significant amount of work performed at TWI is given in a number of published papers and reports. TWI also runs a number of Standard and Tailored Training Courses.
Projects performed in the Optoelectronics area
The Core Research Programme (CRP). Member companies have free access to these generic R&D projects. The work forms the basis of TWI's multi-million pound funded programme of industrially aligned research. The projects relevant to the Optoelectronics area are given below.
- Development of low volume rapid dispense/cure adhesive system for optoelectronics & sensors
- Chemical coatings
Group Sponsored Projects (GSPs). These R&D projects are funded by a number of member companies, usually to address the medium term needs within a particular industrial sector. Results of the work are only available to the group of participating sponsors. The projects relevant to the Electronic Packaging area are given below.
- Measurement of fibre attachment adhesive shrinkage during curing
Projects being formed
- High speed adhesive manufacturing technology for the precision placement of optical elements.
Single Client Projects (SCPs). TWI conducts several hundred of these strictly confidential projects per year. The following list gives an indication of the types of projects undertaken. The Case Studies, which have all been cleared with the sponsoring companies, give further details.
- Development of laser ferrule welding technology
- Resistance welding for ferrule attachment
- Low heat input/hermetic package sealing
- Assessment of the impact of assembly processes on fibre alignment / stability
- Development of packaging technology for harsh environments
- Development of low stress interconnection technology
- Development of production alignment jigs
- Projection Welding Of Fibre Optic Receiver (Case Study)
- Optoelectronics and Sol Gels (Case Study)
Postgraduate Training Partnership (PTP) Work Ongoing which is relevant to the Optoelectronics Industry Sector
- Long term durability of adhesive joints
Related Knowledge Summaries
- Die Attachment
- Wire Bonding
- Electrostatic Bonding
- Sol Gel
- HVOF Spraying
- Light Cure
- Adhesive Bonding
- Glass-to Metal Seal
Related Best Practice Guides
TWI Published papers and reports related to the Optoelectronics area
Taylor A: 'Sol-gel: synthesising glasses and ceramics', TWI Bulletin, Vol. 137, No. 2, March/April 96, pp 32-34
Foster C J: 'Assembly and interconnection of microsystems', IEE Coloquium on Assembly and Connections in Microsystems, London, UK, 26 Feb 1997
Copyright © 2001, TWI Ltd
