Technology file
Wire bonding
Expertise
| Wedge bonds |
 |
TWI's Microtechnology Section has been at the forefront of developments in wire bonding for over 30 years. Its R&D work and technical support for industry covers:
- Aluminium, gold, copper and range of specialist wires
- Ball/wedge, ball bumping, and wedge/wedge
- 17µm - 500µm using standard capillaries and wedge tools
- Down to 7µm using purpose built tools
- Ultrasonic, thermosonic & thermocompression
- Rigid, soft & compliant substrates
Equipment
| Name of Equipment | Comments |
| K&S 4124 manual ball bonder | Ball bonding and bumping |
| K&S 4526 semi-automatic deep access wedge bonder | 90° feed deep access wedge with loop bonding |
| K&S 4123 manual wedge bonder | 45° feed wedge bonding |
| Orthodyne model 20 heavy wire bonder | Up to 500µm wire |
| Dage BT100 materials tester | Die shear testing |
| Dage series 4000 wire-pull/ ball-shear tester | Multipurpose machine. Data analysis software. |
| Unitek micropull v wirebond pull tester MP5/230 | |
| Hesse & Knipps BJ820 Automatic wedge bonder | Gold and aluminium wire High speed (production mode 7 wires per second) Range of loop configurations possible Touch down recognition (good for thin metallisations) Precision wire deformation control for bond repeatability |
Project Work
- Prototyping, feasibility studies
- Trouble shooting & failure analysis
- Fatigue, mechanical & non destructive testing
- Tailored & scheduled training courses
- Environmental testing
For further information, please email your request to micro@twi.co.uk.
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