Technology file
Diffusion bonding
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- a solid state process requiring no filler material |
Copper heat exchanger produced by diffusion bonding a series of 1mm thick metal shims |
Expertise
TWI's Advanced Materials & Processes Department offers over 20 years' experience in uniaxial and isostatic diffusion bonding. Carried out at around 80% of the material's melting point and under a small load, copper, nickel alloy, stainless steel, titanium alloys, ODS alloys and ceramics have been successfully diffusion bonded at TWI.Resource
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a range of equipment provides:
- - uniaxial loading
- - hot isostatic pressing
- - induction heating
- - radiant heating (up to 1850°C)
- advice on process selection & quality issues
- feasibility studies & process development
- applications development & pre-production trials
- testing & evaluation facilities
All TWI's confidential consultancy and project work is conducted to ISO 9001 quality standard
Why not search the site for more information on diffusion bonding
Want to discuss diffusion bonding?
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Mail to twi_industrial@twi.co.uk if your company is not an Industrial Member.
Copyright by TWI, 1999
Information and advice from TWI and its partners are provided in good faith and based, where appropriate, on the best engineering knowledge available at the time and incorporated into TWI's website in accordance with TWI's ISO 9001:2000 accredited status. No warranty expressed or implied is given regarding the results or effects of applying information or advice obtained from the website, nor is any responsibility accepted for any consequential loss or damage.
